Surface Mount Assembly and Rework
The article covers a wide range of topics including hand soldering, machine soldering, and rework. It also delves into various types of solders, fluxes, and cleaning compounds used in Surface Mount Assembly manufacturing. Finally, ESD (Electrostatic Discharge) precautions that need to be taken while working with sensitive components are also provided.
Reliability Enhancement of Electronic Assemblies
The article describes as to how to improve the reliability of electronic assemblies used in commercial and industrial applications using accelerated stress tests. Particularly, Environmental Stress Screening (ESS), a popular way of screening electronic assemblies and products has been described. The basic idea is to subject the units under test (UUTs) to accelerated environmental conditions such as temperature, humidity, vibration, etc.
Surface Mound Devices – Passive, and Active Components
Brief: The tutorial provides a review of SMD (Surface Mount Devices) components including passive components, active components, and ICs. SMDs differ from conventional components that the later use through-hole technology to solder the components whereas SMDs, as the name implies, soldering is done on the surface of the PCBs itself. One biggest advantage of SMDs is that they allow for higher density of components allowing smaller footprints. SMD PCAs are widely used in LAPTOPs, Mobiles, and PDAs. The ICs such as QFP, BGA, SOIC have been discussed.
Introduction to Nano-Technology
Nano-Technology (Nanotech) is developing very rapidly for the past several years. The article describes several types of nano-technologies, nano-electronics, nano-technology products, and computational nanotech. The future of nanotech is also discussed.