| TAB, Tape Automated Bonding |
The process of mounting the integrated circuit die directly to the surface of the substrate, and interconnecting the two together using a fine lead frame.
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| Tented Via |
A blind or thru-via that has the exposed surface on the primary, or secondary , or both sides of packaging and interconnecting structure fully covered by a
masking material such as a dry film polymer covering (solder mask), etc., in order to prevent hole access by process solution solder, or contamination. |
| Termination |
The metallization surfaces, or in some cases, metal end clips on the ends of passive chip components. |
| Thermal Cycling |
A method to induce accelerated stress on components by heating and cooling in an air circulating oven to verify reliability. |
| Thermal Expansion Mismatch |
The absolute difference in thermal expansion of two materials. |
| Thixotropic |
The quality of certain materials that are paste or gel-like at rest but fluid when stressed. |
| Thru-Via |
A via that is connected between the primary and secondary side of a double sided or multilayer packaging and interconnecting structure. |
| Tinning |
A process for the application of solder coating on component leads, conductors and terminals to enhance solderability. |
| Type I SMA |
SMT using surface mounted devices on one or both sides of the substrate. The assembly is reflow soldered in one or two passes depending on the
configuration. |
| Type II SMA |
SMT using surface mounted devices on one or both sides of the substrate and through-hole devices on the primary side. The assembly is reflow soldered on
the primary side and wave soldered on the secondary side. |
