|TAB, Tape Automated Bonding
||The process of mounting the integrated circuit die directly to the surface of the substrate, and interconnecting the two together using a fine lead frame.
||A blind or thru-via that has the exposed surface on the primary, or secondary , or both sides of packaging and interconnecting structure fully covered by a
masking material such as a dry film polymer covering (solder mask), etc., in order to prevent hole access by process solution solder, or contamination.
||The metallization surfaces, or in some cases, metal end clips on the ends of passive chip components.
||A method to induce accelerated stress on components by heating and cooling in an air circulating oven to verify reliability.
|Thermal Expansion Mismatch
||The absolute difference in thermal expansion of two materials.
||The quality of certain materials that are paste or gel-like at rest but fluid when stressed.
||A via that is connected between the primary and secondary side of a double sided or multilayer packaging and interconnecting structure.
||A process for the application of solder coating on component leads, conductors and terminals to enhance solderability.
|Type I SMA
||SMT using surface mounted devices on one or both sides of the substrate. The assembly is reflow soldered in one or two passes depending on the
|Type II SMA
||SMT using surface mounted devices on one or both sides of the substrate and through-hole devices on the primary side. The assembly is reflow soldered on
the primary side and wave soldered on the secondary side.