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Chip-On-Board Technology brings unique assembly
options to the systems designer. In this technology the silicon die is glued
directly to the surface of a printed circuit board between the die and the PCB
or AL2O3 to establish the electric connection; a coating of opaque epoxy resin
is deposited over the die to protect it against shocks and the harmful effects
of light.
Features/Benefits:
A populated circuit board is shown below. It has several COBs bonded on the board. You can also see passive chip components on the board.
A
detailed view of COB is shown in the following figure:
As seen from the above figure, die is attached directly to
the PCB, and wires are bonded to the PCB pads directly. The entire die
attachment is normally encapsulated in an adhesive. COB is useful when you want
to minimize the space taken by the components. It also minimizes stray
capacitance, and inductance due to smaller sizes of the wires.
Typical applications of SMT components:
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