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Active Components
Diodes
SOT Small Outline Transistors
Diodes:
Diode is a two-terminal semiconductor device that
will allow current to flow through it in only one direction. With the proper
voltage polarity across the device, it will act as a conductor. When the voltage
polarity is reversed, the device will act as a nonconductor, allowing no current
to flow.
Diode
The transistor is a solid-state
semiconductor device that can be used for amplification, switching, voltage
stabilization, signal modulation and many other functions. It allows a variable
current, from an external source, to flow between two of its terminals depending
on the smaller voltage or current applied to a third terminal. Transistors are
made either as separate components or as part of an integrated circuit.
Transistor
SMALL OUTLINE TRANSISTOR SOT package is a
rectangular surface mount transistor or diode with three or more gull wings
leads. The leads are on two length sides of the package. Popular sizes are the
SOT23, SOT143, SOT223 and SOT89.
1. SOT23: SOT23 is a Plastic surface-mounted package with 3 leads.
Dimensions
(in mm):
Dual-In-Line:
Dual in-line package (DIP), sometimes called a DIL
package, is an electronic device package with a rectangular housing and two
parallel rows of electrical connecting pins, usually protruding from the longer
sides of the package and bent downward. A DIP is usually referred to as a DIPn,
where n is the total number of pins. For example, a microcircuit package with
two rows of seven vertical leads would be a DIP14.
3.1 SOIC- Small Outline Integrated Circuit.
14 Lead Plastic Dual-In-Line Package
Small Outline Integrated Circuit is the standard package
for logic ICs and it is the equivalent (although smaller) of the DIL package for
leaded components.
3.2 SSOP – Shrink Small Outline Package.
Shrink Small Outline Package is smaller than the SOIC and
has a pin spacing of 0.635 mm.
3.3 TSSOP – Thin Shrink Small Outline package.
TSSOP packages are ultra thin SOPs with a package
L-Leaded mounting height of less than 1.27 mm, and are suited to ultra-thin
electronic equipment such as smart cards.
Type-I
Type-1 TSSOP have leads on the shorter side of the package as shown in the figure.
Type-II
Type-II TSSOP have leads on the longer side of the package as shown in the figure above.
3.4 SOJ (Small Out-line J-Leaded Package):
SOJ packages are characterized by J-shaped leads which
are drawn out from each package body in two directions, and can be mounted flat.
The standard lead pitch is typically 1.27 mm (50 mil).
Note: 1mil=1/1000 of an inch.
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