Material

Package Name

Pin Count

Pitches (mm)

Plastic

SOP (Small Out-line L-Leaded Package)

8,16

1.27

24,28,32,40,44

1.0

SSOP (Shrink Small Out-line L-Leaded Package)

20

0.95

30,32,60,64,70

0.8

60

0.65

TSOP (1) (Thin Small Out-line L-Leaded Package)

32,40

0.5

TSOP (2) (Thin Small Out-line L-Leaded Package)

26/20,26/24,28/24,28,32,

44/40,44,48,50/44,50,

54,66,70/64,70,86

1.27

1.27

0.8

0.65

0.5

QFP (Quad Flat L-Leaded Package)

44,56,64,80,100,128,

160,208,240,272,304

1.0

44,56

0.8

64,80,100

0.65

High Heat Dissipation QFP

208

0.5

TQFP (Thin Quad Flat L-Leaded Package)

44, 48, 64, 80, 100, 120

0.8

0.5

0.4

LQFP (Low Profile Quad Flat)

144, 176, 208

0.5

SOJ (Small Out-line J-Leaded Package)

26/20, 26/24, 28/24, 28,

32, 36, 40, 42, 50

1.27

QFJ (Quad Flat J-Leaded Package)

18, 20, 22, 28, 32, 44, 68,84

1.27

BGA/FBGA (Ball Grid Array/Fine Pitch BGA)

48, 84, 104, 144, 176, 224,256, 352, 420, 560

1.27

1.0

0.8

FLGA (Fine Pitch Land Grid Array)

49, 56, 84

0.8

Ceramic

W-CSP (Wafer Level Chip Size Package)

Custom design

0.65

0.5