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8.  References

 1. Practical Reliability Engineering
            Patric D.T.O’Connor, John Wiley & Sons

2. Reliability by Design
            A.C.Brombacher John Wiley &Sons

3. Failure Mechanisms in semi conductor devices
            Ameresekere John Wiley & Sons 

4. Environmental Stress Screening
            Lloyd W.Condra,

5. Accelerated Testing for Product Reliability and Assurance
            Lloyd W. Condra Hanse Environmental Test Report Series 94-001 (May’94)

6. Environmental Stress Screening
            Seminar Material by ETDC, Bangalore


9. Related Standards:

 

I. US MIL-STD-756 : Reference for reliability prediction. It covers the following aspects of reliability prediction:
            1. The prediction plan as part of the reliability programme plan, related to the various phases of the development programme.
            2. Procedures for performing the reliability prediction, including modelling methods and data sources. MIL-HBK-217 is the referenced source for electronic equipment parts-count and stress analysis reliability prediction.
            3. Procedures for documentation and reporting of the predictions.

II. US MIL-HBK-217C Source for electronic equipment parts-count and stress analysis reliability prediction

III. Reliability Stress Analysis (British Telecom)  : BT-HRD-4

IV. US MIL-STD-781: Reliability Qualification and Production Acceptance Tests- Exponential Distribution

            The purpose of MIL-STD-781 testing is to show, within the specified levels of risk, that the equipment meets the specified and contractually agreed performance levels. Therefore, the objective is not to induce failures by applying unrealistic stresses. MIL-STD-781 test plans are based upon the assumption of a  constant failure rate, so MTBF is used as the reliability index. Therefore, MIL-STD-781 tests are appropriate for equipment where a constant failure rate is likely to be encountered, such as fairly complex electronic equipment, after an initial burn-in period.

V. US MIL-STD-810 Environmental Qualification Tests

VI. BS 5760: Reliability of Systems, Equipment and Components

VII. MIL-STD-785: Reliability Programs for Systems and Equipments, Development and Production

Implementation Level PCA, Module, Sub-System, System
Application of Power Must be considered as minimum. It is preferable that the items be tested dynamically (with signals ON)
Monitoring during ESS If possible, the status of assemblies is to be monitored during ESS. If the monitoring of the assemblies is not possible due to some reason, intermediate stage functional tests must be performed where possible.
Functional tests Perform Pre/Post screen functional tests. Intermediate stage tests may be done if found useful.
Corrective Action

Implement closed loop failure analysis and corrective action.
     * Analyze failure for defect cause
     * Correct defect at source
     * Add, delete, or modify screens as dictated by the defect analysis.

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