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A
portion of a conductive pattern usually, but not always, used for the
connection attachment (such as component lead or a wire). Also called a
"land". |
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Paste Flux
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A flux formulated in the
form of a paste. Flux may also be in fluid form.
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PCA
or PWA, Printed Circuit or Wiring Assembly
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A PCB containing attached
components and interconnecting traces.
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PLCC,
Plastic Leaded Chip Carrier
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A component package that has
J-leads on four sides with standard spacing between leads.
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Preheating
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The process of raising board
temperature to a level just below that of solder reflow to reduce overall
thermal shock.
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Primary Side
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The side of the packaging
and interconnecting structure equivalent to layer #1. This is commonly
referred to as the component side in through-hole technology. In SMT, the
primary side is reflow soldered.
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Print Head
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The
Assembly in the printer that houses and controls the squeegee
blade(s)
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Printed
Circuit Board (PCB)/ Printed Wiring Board (PWB)
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The generic term for
completely processed printed circuit configurations. It includes rigid or
flexible single, double, or multilayer boards. A substrate of epoxy glass
, clad metal, or other material upon which a pattern of conductive traces
is formed to interconnect components.
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Printed
Wiring Assembly (PWA)
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A printed wiring board on
which separately manufactured components and parts have been added. The
generic term for a printed wiring board after all electronic components
have been completely attached. Also called “ Printed circuit
Assembly”.
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PTH,
Plated Through Hole
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A plated via used as an
interconnection between top and bottom sides or inner layers of PWB.
Intended for mounting component leads into through-hole technology.
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Quadpack
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Generic term for SMT
packages with leads on all four sides. Most commonly used to describe
packages with gull wing leads. Also known as flat pack, but flat pack may
have gull wing leads on either two or four sides.
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Reflow Soldering
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A process of joining
metallic surfaces (without the melting of base metals) through the mass
heating of preplaced solder paste to solder fillets in the metallized
areas.
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Repair
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Restoring the functional capability of a defective PCB, which
may or may not affect appearance interchangeability and/or
uniformity.
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Resist
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Coating material used to
mask or protect selected areas of pattern from the action of an etchant,
solder or plating.
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Rework
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The process of bringing a
defective assembly into conformance with required level of quality. This
is usually done soon after soldering. This
often include operations like desoldering, soldering , and cleaning.
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Rheology
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The study of the flow
properties of viscous materials.
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