The process of mounting the integrated circuit die directly to the surface of the substrate, and interconnecting the two together using a fine lead frame.
A blind or thru-via that has the exposed surface on the primary, or secondary , or both sides of packaging and interconnecting structure fully covered by a masking material such as a dry film polymer covering (solder mask), etc., in order to prevent hole access by process solution solder, or contamination.
The metallization surfaces, or in some cases, metal end clips on the ends of passive chip components.
A method to induce accelerated stress on components by heating and cooling in an air circulating oven to verify reliability.
Thermal Expansion Mismatch
The absolute difference in thermal expansion of two materials.
The quality of certain materials that are paste or gel-like at rest but fluid when stressed.
A via that is connected between the primary and secondary side of a double sided or multilayer packaging and interconnecting structure.
A process for the application of solder coating on component leads, conductors and terminals to enhance solderability.
Type I SMA
SMT using surface mounted devices on one or both sides of the substrate. The assembly is reflow soldered in one or two passes depending on the configuration.
Type II SMA
SMT using surface mounted devices on one or both sides of the substrate and through-hole devices on the primary side. The assembly is reflow soldered on the primary side and wave soldered on the secondary side.