1.2 Type II assembly:
Here the primary side contains both through-hole and surface mount
components. The secondary side contains only surface mount components.
This kind of mixed assembly is still prevalent primarily due to
unavailability/ cost considerations of surface mount components to that of
through-hole components. The typical process steps are shown below.
The above classification is
given in broad sense and there is no standard industry classification. As can be
seen, assembly of mixed component board involves more operations and therefore
takes more time for assembly and inspection/ rework.
