 |
||||
 | ||||
1 Soldering in Electronics
1 What is Soldering
2 Welding, Brazing, and Soldering
3 Through hole technology
4 Soldering methods
4.1 Hand soldering
4.2 Machine soldering
5 Basic process steps involved in the manufacture of SMD boards
2 Introduction to SMT
1. Benefits of SMT
2. SMT packages commonly used
2.1 Passive components
2.2 Active components
2.3 Fine pitch components
3. Component package shipping methods
4. Component procurement guidelines
3 Manufacturing
1. Classification of manufacturing methods
1.1 Type IA, IB assembly
1.2 Type II assembly
4 Solders, fluxes, and solderability
1. Solder Alloys and applications
2. Availability of solders
2.1 Cored wire
2.2 Solder Paste (Solder Cream)
2.3 Solder preforms
2.4 Solder rods
3. Flux and its requirement
3.1 Inorganic acid
3.2 Organic acid
3.3 Rosin
3.4 No clean
4. Storage of solder paste
5. Solderability
5.1 Solderability testing, edge dip method
5 Solder Printing
1. Printing Technologies
1.1 Dispensing
1.2 Screen printing
1.3 Stencil printing
2. Comparison of Screen and Stencil Printing
3. Printing for SMT
3.1 Solder paste viscosity
3.2 Print thickness
3.3 Squeegee wear, Pressure, and hardness
6 Component placement
1. Manual placement of parts
2. Automatic placement of parts
7 Manual soldering and repair
1. Introduction
2. Use of soldering iron
2.1 Hot gas soldering
2.2 Resistance soldering
3. Basic rules for hand-soldering
4. Desoldering and removing of components
4.1 Desoldering of DIL-type packages
4.2 Repair of printed boards carrying SMCs
4.3 Removal of SMCs from PCBs
4.4 Methods of remounting
5. Repair of damaged surface mount pads
8 Reflow soldering
9 Cleaning
1. Requirement of cleaning
2. Cleaning options
2.1 Aqueous cleaning
2.2 Solvent cleaning
2.3 No-clean flux
3. Cleanliness test methods
3.1 Visual examination
3.2 Solvent Extraction
4. Conformal coating
10 Inspection and Rework
1. Tools for inspecting assemblies
2. Techniques for Inspecting Assemblies
3. Touchup, Rework and repair
4. Tools Required
5. Soldering and desoldering techniques
5.1 Using hot-air jets
5.2 solder irons
6. Working with multi-lead components
11 Handling and ESD control
1. Electrostatic discharge
2. ESD and EOS (Electrical Overstress)
3. Surface resistivity
4. Human body model
5. Requirements of static-free work station
6. Places where ESD control is required
7. Summary
|
|